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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
sakriti opis
- Izdavač: Springer Verlag, Singapore
- Kod:
- Godina izdavanja: 2018
- Jezik: Engleski jezik
- Uvez: Vezana
- Broj stranica: 303
- Širina pakiranja: 16 cm
- Visina pakiranja: 24.1 cm
- Dubina pakiranja: 2.3 cm
- Težina pakiranja: 660 g
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